I3 I5 Industrial Embedded PC

Embedded Computer I5 6200u Fanless Mini PC IPC

Features of Embedded Industrial Computers

While embedded computers encompass a wide variety of specialized systems, they share several common characteristics that enable them to perform excellently in various computing environments:

Compact Design
The compact size achieved through soldered components and SoC (System on Chip) architecture reduces component complexity, allowing for various applications in confined spaces and challenging deployments.

Passive Cooling
Embedded industrial computers utilize passive cooling methods, such as heat pipes and heat sinks, eliminating the need for mechanical fans. Mechanical fans can expose internal components to dust and debris. Most embedded industrial computers employ low Thermal Design Power (TDP) components alongside passive cooling; this combination is a key feature of embedded computing, helping dissipate harmful heat generated by components. This design allows embedded industrial computers to be installed in harsh environments where temperature control is not feasible.

Robust Design Features
Robust design characteristics support a wide operating temperature range, broad voltage range, and resistance to shock and vibration. These features are essential for ensuring product longevity and stability while minimizing points of failure. The wide operating temperature range enables deployment in outdoor environments where temperature control is difficult, and wide voltage protection is necessary in environments prone to voltage spikes. Additionally, resistance to shock and vibration is critical for mobile applications, especially for mission-critical services that require high reliability.